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Parts in this section have a pin count of 14 pins or more. The lower part numbers were established in the 1960s and 1970s, then higher part numbers were added incrementally over decades. IC manufacturers continue to make a core subset of this group, but many of these part numbers are considered obsolete and no longer manufactured.
The first part number in the series, the 7400, is a 14-pin IC containing four two-input NAND gates. Each gate uses two input pins and one output pin, with the remaining two pins being power (+5 V) and ground. This part was made in various through-hole and surface-mount packages, including flat pack and plastic/ceramic dual in-line.
For example, the 7404 TTL chip which has 14 pins and the 4049 CMOS chip which has 16 pins, 2 of which are used for power/referencing, and 12 of which are used by the inputs and outputs of the six inverters (the 4049 has 2 pins with no connection).
The 74HC00 family followed, and improved upon, the 74C00 series (which provided an alternative CMOS logic family to the 4000 series but retained the part number scheme and pinouts of the standard 7400 series (especially the 74LS00 series)) . Some specifications include: [1] DC supply voltage; DC input voltage range; DC output voltage range
IC power-supply pins are voltage and current supply terminals found on integrated circuits (ICs) in electrical engineering, electronic engineering, and integrated circuit design. [ a ] ICs have at least two pins that connect to the power rails of the circuit in which they are installed.
Zig-zag in-line package. The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits.It was intended as a replacement for dual in-line packaging (DIL or DIP).
Although TO-92 devices are mainly used in low-voltage / low-current (<30 V; <1 A) applications, high-voltage (600 Volt Vce) and high-current (5 A Ic) devices are available. Nominal maximum power dissipation is less than one watt (600 mW).
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
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