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The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state.
A convection reflow oven. A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a ...
For an effective soldering process, soldering must be carried out under carefully calibrated conditions in a reflow oven. Convection Reflow Oven Detailed Description. There are two main profile types used today in soldering: The Ramp-Soak-Spike (RSS) Ramp to Spike (RTS) Profile temperature data plotted against reflow oven settings
The viscosity of the flux decreases as the temperature of the reflow oven increases. Lead-free reflow soldering temperatures are higher, which results in more graping. Graping is also caused by increased surface oxidation. The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area ...
Hot-bar reflow is a selective soldering process where two pre-fluxed, solder coated parts are heated with a heating element (called a thermode) to a temperature sufficient to melt the solder. Pressure is applied through the entire process (usually 15 seconds) to ensure that components stay in place during cooling.
Printing is followed by a complete reflow soldering process. The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux. Thereafter, the solder melts.
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