enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Example of reflow soldering thermal profile. Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste ...

3. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux.

4. Thermal profiling - Wikipedia

   en.wikipedia.org/wiki/Thermal_profiling

   In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.

5. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The graping phenomenon can be resolved utilizing proper solder materials in addition to correct reflow profile settings. Solder powders are available that provide a tighter distribution range as well as a high oxidation barrier. This barrier not only improves the paste release from the stencil, but also provides an ideal surface area-to-volume ...

6. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn 10 Pb 90. Solder paste for rework of BGA boards. [51] Alloy of choice for general SMT assembly. Sn 95.5 Ag 3.8 Cu 0.7: 217 [89] Yes: Near: SN96C. Preferred by the European IDEALS consortium for reflow soldering.

7. Rework (electronics) - Wikipedia

   en.wikipedia.org/wiki/Rework_(electronics)

   Reflowing as a rework technique, similar to the manufacturing process of reflow soldering, involves dismantling the equipment to remove the faulty circuit board, pre-heating the whole board in an oven, heating the non-functioning component further to melt the solder, then cooling, following a carefully determined thermal profile, and ...