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In computing and electronics, liquid cooling involves the technology that uses a special water block to conduct heat away from the processor as well as the chipset. [1] This method can also be used in combination with other traditional cooling methods such as those that use air. The application to microelectronics is either indirect or direct.
The Roman hypocaust is an early example of a type of radiator for building space heating. Franz San Galli, a Prussian-born Russian businessman living in St. Petersburg, is credited with inventing the heating radiator around 1855, [1] [2] having received a radiator patent in 1857, [3] but American Joseph Nason developed a primitive radiator in 1841 [4] and received a number of U.S. patents for ...
Heat sinks are widely used in electronics and have become essential to modern microelectronics. In common use, it is a metal object brought into contact with an electronic component's hot surface—though in most cases, a thin thermal interface material mediates between the two surfaces.
A radiator is a device that transfers heat to a medium primarily through thermal radiation.In practice, the term radiator is often applied to any number of devices in which a fluid circulates through exposed pipes (often with fins or other means of increasing surface area), notwithstanding that such devices tend to transfer heat mainly by convection and might logically be called convectors.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Most spacecraft radiators reject between 100 and 350 W of internally generated electronics waste heat per square meter. Radiators' weight typically varies from almost nothing, if an existing structural panel is used as a radiator, to around 12 kg/m 2 for a heavy deployable radiator and its support structure.
The lawsuit accused Target's board of directors of overlooking the risk of negative backlash and led the company to lose over $25 billion in market capitalization.
Thermal engineering may be practiced by mechanical engineers and chemical engineers. One or more of the following disciplines may be involved in solving a particular thermal engineering problem: thermodynamics, fluid mechanics, heat transfer, or mass transfer. One branch of knowledge used frequently in thermal engineering is that of thermofluids.