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Thin-film printing technology is being used to apply solid-state lithium polymers to a variety of substrates to create unique batteries for specialized applications. Thin-film batteries can be deposited directly onto chips or chip packages in any shape or size. Flexible batteries can be made by printing onto plastic, thin metal foil, or paper.
Anode-free lithium ion batteries have been demonstrated using a variety of cathode materials, such as LiFePO 4, LiCoO 2, and LiNi 1/3 Mn 1/3 Co 1/3 (NMC 111).. These intercalation-type cathodes typically offer limited Li content (14.3 at.% for LiFePO4, 25 at.% for LiCoO2 and LiNixCoyMn1-x-yO2), although they remain the primary research targets. [2]
Therefore, LAGP is a suitable candidate for all-solid-state thin-film lithium-ion batteries, in which the electrolyte thickness ranges from 1 to some hundreds of micrometres. [ 4 ] [ 13 ] The good mechanical strength of LAGP effectively suppress lithium dendrites during lithium stripping and plating, reducing the risk of internal short-circuit ...
Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
In a thin film Li-ion battery, the separator must be a thin and flexible solid. Typically today, this material is a polymer-based material. Since thin film batteries are made of all solid materials, allows one to use simpler separator materials in these systems such as Xerox paper rather than in liquid based Li-ion batteries.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).
A photograph of a lab-scale slot-die coating tool for thin film materials research. Miniaturized slot-die tools have become increasingly available to support the development of new roll-to-roll compatible processes prior to the requirement of full pilot- and production-scale equipment. These tools feature similar core components and ...