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  2. International Patent Classification - Wikipedia

    en.wikipedia.org/wiki/International_Patent...

    The International Patent Classification (IPC) is a hierarchical patent classification system used in over 100 countries to classify the content of patents in a uniform manner. It was created under the Strasbourg Agreement (1971), one of a number of treaties administered by the World Intellectual Property Organization (WIPO).

  3. Patentscope - Wikipedia

    en.wikipedia.org/wiki/Patentscope

    PATENTSCOPE is a global patent database and search system developed and maintained by the World Intellectual Property Organization. It provides free and open access to a vast collection of international patent documents, including patent applications , granted patents, and related technical information.

  4. Strasbourg Agreement Concerning the International Patent ...

    en.wikipedia.org/wiki/Strasbourg_Agreement...

    The Strasbourg Agreement Concerning the International Patent Classification (or IPC), also known as the IPC Agreement, is an international treaty that established a common classification for patents for invention, inventors' certificates, utility models and utility certificates, known as the "International Patent Classification" (IPC). [6]

  5. Patent classification - Wikipedia

    en.wikipedia.org/wiki/Patent_classification

    Searches based on patent classifications can identify documents of different languages by using the codes (classes) of the system, rather than words. Patent classification systems were originally developed for sorting paper documents, but are nowadays used for searching patent databases.

  6. Cooperative Patent Classification - Wikipedia

    en.wikipedia.org/wiki/Cooperative_Patent...

    An example of the CPC classification scheme [4] in the area of agriculture is shown in the figure. The text in curly brackets {..} refers to text provided by the CPC classification scheme. The rest of the text refers to text originating from the International Patent Classification.

  7. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.

  8. Sports At Any Cost - The Huffington Post

    projects.huffingtonpost.com/projects/ncaa/sports...

    Brad Wolverton is a senior writer and Sandhya Kambhampati is a database reporter at The Chronicle of Higher Education. Design and art direction by Hilary Fung and Alissa Scheller, visual editors for HuffPost. Reporting contributions from Nicky Forster, data fellow for HuffPost, and Isaac Stein, reporting intern for The Chronicle.

  9. Derwent World Patents Index - Wikipedia

    en.wikipedia.org/wiki/Derwent_World_Patents_Index

    The Derwent World Patents Index (DWPI) is a database containing patent applications and grants from 44 of the world's patent issuing authorities. [1] [2]Compiled in English by editorial staff, the database provides a short abstract detailing the nature and use of the invention described in a patent and is indexed into alphanumeric technology categories to allow retrieval of relevant patent ...