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  2. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .

  3. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .

  4. Die preparation - Wikipedia

    en.wikipedia.org/wiki/Die_preparation

    In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die.

  5. Electrical discharge machining - Wikipedia

    en.wikipedia.org/wiki/Electrical_discharge_machining

    CNC Wire-cut EDM machine 1 Wire. 2 Electrical discharge erosion (Electric arc). 3 Electrical potential. 4 Workpiece. In wire electrical discharge machining (WEDM), also known as wire-cut EDM and wire cutting, [30] a thin single-strand metal wire, usually brass, is fed through the workpiece, submerged in a tank of dielectric fluid, typically ...

  6. Die (manufacturing) - Wikipedia

    en.wikipedia.org/wiki/Die_(manufacturing)

    A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, [1] as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not. Like molds, dies are generally customized to the item they are ...

  7. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    The yield went down to 32% with an increase in die size to 100 mm 2. [189] The number of killer defects on a wafer, regardless of die size, can be noted as the defect density (or D 0) of the wafer per unit area, usually cm 2. The fab tests the chips on the wafer with an electronic tester that presses tiny probes against the chip. The machine ...

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. CNC router - Wikipedia

    en.wikipedia.org/wiki/CNC_router

    CNC routers can perform the tasks of many carpentry shop machines such as the panel saw, the spindle moulder, and the boring machine. They can also cut joinery such as mortises and tenons. A CNC router is very similar in concept to a CNC milling machine. Instead of routing by hand, tool paths are controlled via computer numerical control.

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