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Splicebox with different plugs Splicebox with interior splice cassette. A splice box (also known as splice distributor) is a housing in which fiber optic cables begin or end. Fiber optics are fanned out in splice boxes that are situated at the end of fiber optic transmission paths.
TI-HI, Ti-High, Tie-High, or Ti by Hi is a term often used in the logistics industry.. It refers to the number of boxes/cartons stored on a layer, or tier, (the TI) and the number of layers high that these will be stacked on the pallet (the HI). [1]
ISO 668 – Series 1 freight containers – Classification, dimensions and ratings is an ISO international standard which nominally classifies intermodal freight shipping containers, and standardizes their sizes, measurements and weight specifications. [1] The current version of the standard is the Seventh edition (2020), which integrates ...
To isolate the splice, an insulating sleeve made of paper or plastic is pushed over it. The splicing of copper wires is mainly used on paper insulated wires. LSA techniques (LSA: soldering, screwing and stripping free) are used to connect copper wires, making the copper wires faster and easier to connect.
block A pulley with one or more sheaves or grooves over which a line is roved. It can be used to change the direction of the line, or in pairs used to form a tackle. [2] block, fiddle A block with two sheaves in the same plane, one being smaller than the other, giving the block a somewhat violin appearance. block, snatch
The female part of the connector is the 7×7× 4 + 1 ⁄ 2 in (180×180×110 mm) corner casting, which forms each of the eight corners, welded to the container itself, and has no moving parts, only an oval hole in the tops of the four upper corners, and in the bottom of the four lower corners.
(Reuters) -Major food companies, including Kraft Heinz, Mondelez and Coca-Cola, were hit with a new lawsuit in the U.S. on Tuesday accusing them of designing and marketing "ultra-processed" foods ...
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.