enow.com Web Search

Search results

1. Results from the WOW.Com Content Network

2. Paint adhesion testing - Wikipedia

   en.wikipedia.org/wiki/Paint_adhesion_testing

   In the paint and coating industries, paint adhesion testing is often used to determine if the paint or coating will adhere properly to the substrates to which they are applied. Several tests measure the resistance of paints and coatings from substrates: cross-cut test, scrape adhesion, pull-off test, and others. [1] Cross Cut Tester

3. MIL-STD-883 - Wikipedia

   en.wikipedia.org/wiki/MIL-STD-883

   2023.5 Nondestructive bond pull; 2024.2 Lid torque for glass-frit-sealed packages; 2025.4 Adhesion of lead finish; 2026 Random vibration; 2027.2 Substrate attach strength; 2028.4 Pin grid package destructive lead pull test; 2029 Ceramic chip carrier bond strength; 2030 Ultrasonic inspection of die attach; 2031.1 Flip chip pull-off test

4. Pull off test - Wikipedia

   en.wikipedia.org/wiki/Pull_off_test

   A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.

5. Wafer bond characterization - Wikipedia

   en.wikipedia.org/wiki/Wafer_bond_characterization

   USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.

6. Wire bonding - Wikipedia

   en.wikipedia.org/wiki/Wire_bonding

   The term wire pull usually refers to the act of pulling a wire with a hook mounted on a pull sensor on a bond tester. However, to promote certain failure modes, wires can be cut and then pulled by tweezers, also mounted on a pull sensor on a bond tester. Usually wires up to 75 μm diameter (3 mil) are classified as thin wire.

7. Tensiometer (surface tension) - Wikipedia

   en.wikipedia.org/wiki/Tensiometer_(surface_tension)

   This method uses a rod which is lowered into a test liquid. The rod is then pulled out of the liquid and the force required to pull the rod is precisely measured. The method isn't standardized but is sometimes used. The Du Noüy-Padday rod pull tensiometer will take measurements quickly and will work with liquids with a wide range of viscosities.