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  2. Pull off test - Wikipedia

    en.wikipedia.org/wiki/Pull_off_test

    Applying the glue automatically and curing with UV light is the next step in automation. This methodology can also be used to measure direct tensile strength or/and the bond strength between two different layers. MIL-STD-883 methods 2011.9 destructive bond pull test [1] and 2031.1 flip chip pull off test [2] apply, as well as JEDEC JESD22-B109.

  3. Paint adhesion testing - Wikipedia

    en.wikipedia.org/wiki/Paint_adhesion_testing

    In the paint and coating industries, paint adhesion testing is often used to determine if the paint or coating will adhere properly to the substrates to which they are applied. Several tests measure the resistance of paints and coatings from substrates: cross-cut test, scrape adhesion, pull-off test, and others. [1] Cross Cut Tester

  4. Delamination - Wikipedia

    en.wikipedia.org/wiki/Delamination

    ASTM provides standards for paint adhesion testing which provides qualitative measures for paints and coatings resistance to delamination from substrates. Tests include cross-cut test, scrape adhesion, [13] and pull-off test. [14]

  5. Surface treatment of PTFE - Wikipedia

    en.wikipedia.org/wiki/Surface_treatment_of_PTFE

    In adhesion tests per ASTM D4541, in which an aluminum stud is bonded to the test surface and the stud is pulled in the direction normal to the surface, both surfaces of the failure interface were analyzed by X-ray photoelectron spectroscopy (XPS). F/C ratio was used as an indicator of the failure mode: F/C of zero corresponds to failure in the ...

  6. Bresle method - Wikipedia

    en.wikipedia.org/wiki/Bresle_method

    A test patch should be as clean as possible. Contamination of a patch can influence the results significantly. Bresle patch injected with 15ml water as in ISO 8502-6 Annex A. The ISO 8502-6 standard prescribes in annex A that certified patches shall be used. This annex describes a stress test to ensure patch adhesion and wash ability.

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  9. Wafer bond characterization - Wikipedia

    en.wikipedia.org/wiki/Wafer_bond_characterization

    Shear testing is the alternative method to determine the strength a bond can withstand. Various variants of shear testing exist. Like with pull testing, the objective is to recreate the failure mode of interest in the test. If that is not possible, the operator should focus on putting the highest possible load on the bond. [18]

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