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The Kaplan–Meier estimator, [1][2] also known as the product limit estimator, is a non-parametric statistic used to estimate the survival function from lifetime data. In medical research, it is often used to measure the fraction of patients living for a certain amount of time after treatment. In other fields, Kaplan–Meier estimators may be ...
Bromochlorodifluoromethane (BCF), also referred to by the code numbers Halon 1211 and Freon 12B1, is a haloalkane with the chemical formula C F 2 Cl Br. It is used for fire suppression, especially for expensive equipment or items that could be damaged by the residue from other types of extinguishers. [ 1 ]
Half-life (symbol t½) is the time required for a quantity (of substance) to reduce to half of its initial value. The term is commonly used in nuclear physics to describe how quickly unstable atoms undergo radioactive decay or how long stable atoms survive. The term is also used more generally to characterize any type of exponential (or, rarely ...
Exponential decay. A quantity undergoing exponential decay. Larger decay constants make the quantity vanish much more rapidly. This plot shows decay for decay constant ( λ) of 25, 5, 1, 1/5, and 1/25 for x from 0 to 5. A quantity is subject to exponential decay if it decreases at a rate proportional to its current value.
The Mil-HDBK-217 reliability calculator manual in combination with RelCalc software (or other comparable tool) enables MTBF reliability rates to be predicted based on design. A concept which is closely related to MTBF, and is important in the computations involving MTBF, is the mean down time (MDT). MDT can be defined as mean time which the ...
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and ...
The survival function is a function that gives the probability that a patient, device, or other object of interest will survive past a certain time. [1] The survival function is also known as the survivor function[2] or reliability function. [3] The term reliability function is common in engineering while the term survival function is used in a ...