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2. Motherboard form factor - Wikipedia

   en.wikipedia.org/wiki/Motherboard_form_factor

   A standard proposed by Intel as a successor to ATX in the early 2000s, according to Intel the layout has better cooling. BTX Boards are flipped in comparison to ATX Boards, so a BTX or MicroBTX Board needs a BTX case, while an ATX style board fits in an ATX case. The RAM slots and the PCI slots are parallel to each other.

3. ATX - Wikipedia

   en.wikipedia.org/wiki/ATX

   An ATX motherboard Comparison of some common motherboard form factors (pen for scale). ATX (Advanced Technology Extended) is a motherboard and power supply configuration specification, patented by David Dent in 1995 at Intel, [1] to improve on previous de facto standards like the AT design.

4. WTX (form factor) - Wikipedia

   en.wikipedia.org/wiki/WTX_(form_factor)

   WTX (for Workstation Technology Extended [citation needed]) was a motherboard form factor specification introduced by Intel at the IDF in September 1998, for its use at high-end, multiprocessor, multiple-hard-disk servers and workstations. The specification had support from major OEMs (Compaq, Dell, Fujitsu, Gateway, Hewlett-Packard, IBM ...

5. DTX (form factor) - Wikipedia

   en.wikipedia.org/wiki/DTX_(form_factor)

   Comparison of the form factors for motherboards ATX, μATX (micro-ATX), DTX, mini-ITX and mini-DTX The DTX form factor is a variation of ATX specification [1] designed especially for small form factor PCs (especially for HTPCs) with dimensions of 8 × 9.6 inches (203 × 244 mm). [2]

6. ZOTAC - Wikipedia

   en.wikipedia.org/wiki/ZOTAC

   ZOTAC Technology Limited is a computer hardware manufacturer founded and based in Hong Kong. [3] The company specializes in producing video cards (GPUs), mini PCs , solid-state drives , [ 4 ] [ 5 ] motherboards , gaming computers [ 6 ] and other computer accessories.

7. Mini ATX - Wikipedia

   en.wikipedia.org/wiki/Mini_ATX

   Mini-ATX motherboards are a smaller form factor of the ATX motherboards. It typically uses surface-mount technology for component placement, solid state capacitors to ensure stable power delivery, and an 8-layer PCB design to increase durability and longevity. This design is aimed to provide a better overall performance and reliability compared ...