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  2. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...

  3. Semiconductor fabrication plant - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_fabrication...

    In the microelectronics industry, a semiconductor fabrication plant, also called a fab or a foundry, is a factory where integrated circuits (ICs) are manufactured. [1]The cleanroom is where all fabrication takes place and contains the machinery for integrated circuit production such as steppers and/or scanners for photolithography, etching, cleaning, and doping.

  4. Fabless manufacturing - Wikipedia

    en.wikipedia.org/wiki/Fabless_manufacturing

    Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication (or fab) to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States , mainland China , and Taiwan .

  5. Foundry model - Wikipedia

    en.wikipedia.org/wiki/Foundry_model

    The separation of design and fabrication became known as the foundry model, with fabless manufacturing outsourcing to semiconductor foundries. [7] Fabless semiconductor companies do not have any semiconductor fabrication capability, instead contracting with a merchant foundry for fabrication. The fabless company concentrates on the research and ...

  6. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    The steps involving testing and packaging of dies, followed by final testing of finished, packaged chips, are called the back end, [118] post-fab, [192] ATMP (Assembly, Test, Marking, and Packaging) [193] or ATP (Assembly, Test and Packaging) of semiconductor manufacturing, and may be carried out by OSAT (OutSourced Assembly and Test) companies ...

  7. List of Intel manufacturing sites - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel...

    Fab 11X Rio Rancho, New Mexico, U.S. 1995 upgrade 2020/2021 with 22/14 300mm, 45 nm/32 nm, Packaging Fab 12 Chandler, Arizona, U.S. 2006 300mm, 22 nm/14 nm/10 nm Fab 22 Chandler, Arizona, U.S. 2002 300mm, 22 nm/14 nm/10 nm Fab 24 Leixlip, Ireland 2006 300mm, 14 nm [4] Fab 28a Kiryat Gat, Israel 1996 300mm, 22 nm Fab 28 Kiryat Gat, Israel

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