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In USB 3.0, dual-bus architecture is used to allow both USB 2.0 (Full Speed, Low Speed, or High Speed) and USB 3.0 (SuperSpeed) operations to take place simultaneously, thus providing backward compatibility. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide ...
The following other wikis use this file: Usage on ast.wikipedia.org Universal Serial Bus; Usage on az.wikipedia.org USB; Usage on bg.wikipedia.org
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The Hi-Speed USB logo. USB 2.0 was released in April 2000, adding a higher maximum signaling rate of 480 Mbit/s (maximum theoretical data throughput 53 MByte/s [29]) named High Speed or High Bandwidth, in addition to the USB 1.x Full Speed signaling rate of 12 Mbit/s (maximum theoretical data throughput 1.2 MByte/s). [30]
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A number of extensions to the USB Specifications have progressively further increased the maximum allowable V_BUS voltage: starting with 6.0 V with USB BC 1.2, [43] to 21.5 V with USB PD 2.0 [44] and 50.9 V with USB PD 3.1, [44] while still maintaining backwards compatibility with USB 2.0 by requiring various forms of handshake before ...
This logo image consists only of simple geometric shapes or text. It does not meet the threshold of originality needed for copyright protection, and is therefore in the public domain. Although it is free of copyright restrictions, this image may still be subject to other restrictions.
This image of simple geometry is ineligible for copyright and therefore in the public domain, because it consists entirely of information that is common property and contains no original authorship. Heptagon