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  2. File:Heat flow in Rod, and variant 1 placement of ...

    en.wikipedia.org/wiki/File:Heat_flow_in_Rod,_and...

    You are free: to share – to copy, distribute and transmit the work; to remix – to adapt the work; Under the following conditions: attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses ...

  3. Heisler chart - Wikipedia

    en.wikipedia.org/wiki/Heisler_Chart

    These first Heisler–Gröber charts were based upon the first term of the exact Fourier series solution for an infinite plane wall: (,) = = [⁡ + ⁡ ⁡], [1]where T i is the initial uniform temperature of the slab, T ∞ is the constant environmental temperature imposed at the boundary, x is the location in the plane wall, λ is the root of λ * tan λ = Bi, and α is thermal diffusivity.

  4. Thermal contact conductance - Wikipedia

    en.wikipedia.org/wiki/Thermal_contact_conductance

    Thermal contact resistance is significant and may dominate for good heat conductors such as metals but can be neglected for poor heat conductors such as insulators. [2] Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials.

  5. Thermal-transfer printing - Wikipedia

    en.wikipedia.org/wiki/Thermal-transfer_printing

    Thermal-transfer printing is done by melting wax within the print heads of a specialized printer. The thermal-transfer print process utilises three main components: a non-movable print head, a carbon ribbon (the ink) and a substrate to be printed, which would typically be paper, synthetics, card or textile materials.

  6. Thermal profiling - Wikipedia

    en.wikipedia.org/wiki/Thermal_profiling

    If the heat transfer is too slow, the flux concentration may remain high and result in cold solder joints, voids and incomplete reflow. [ 9 ] : 16 After the soak segment, the profile enters the ramp-to-peak segment of the profile, which is a given temperature range and time exceeding the melting temperature of the alloy.

  7. Moving heat source model for thin plates - Wikipedia

    en.wikipedia.org/wiki/Moving_heat_source_model...

    In the 1930s metallurgists Albert Portevin and D. Seferian attempted to experimentally determine heat transfer characteristics in welding. [1] They correlated the effects of several factors—material properties, welding process, and part dimensions—on temperature distribution, by performing oxyacetylene (gas) and covered electrode (arc) welds on plates and bars of various profiles, and ...

  8. Heat spreader - Wikipedia

    en.wikipedia.org/wiki/Heat_spreader

    A high enough heat exchanger transfer coefficient is sufficient to avoid the need for a heat spreader. The use of a heat spreader is an important part of an economically optimal design for transferring heat from high to low heat flux media. Examples include: A copper-clad bottom on a steel or stainless steel stove-top cooking container

  9. Chilton and Colburn J-factor analogy - Wikipedia

    en.wikipedia.org/wiki/Chilton_and_Colburn_J...

    The basic mechanisms and mathematics of heat, mass, and momentum transport are essentially the same. Among many analogies (like Reynolds analogy , Prandtl–Taylor analogy) developed to directly relate heat transfer coefficients, mass transfer coefficients and friction factors, Chilton and Colburn J-factor analogy proved to be the most accurate.

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