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  2. Comparison of bootloaders - Wikipedia

    en.wikipedia.org/wiki/Comparison_of_bootloaders

    Open-source, OS-agnostic (run alongside RTOS, Linux or bare-metal), ARM TrustZone-M support, Hardware Security Module support (including TPM 2.0), Integrity and authenticity verification of firmware images. Roll-back to previous image, Encryption, Self-update Name Advanced command Scriptable Supported architecture Supported executable

  3. M.2 - Wikipedia

    en.wikipedia.org/wiki/M.2

    M.2 keying notches in B and M positions; the offsetting of the pins on different sides of an M.2 module is also visible. [11] An M.2 2230 SSD, 22 mm wide and 30 mm long, with the key in the M position, and with a microSD card on top for scale. The large chip on the M.2 module is a single-chip SSD conforming to the M.2 1620 ball grid array (BGA ...

  4. ESP32 - Wikipedia

    en.wikipedia.org/wiki/ESP32

    ESP32 is a series of low-cost, low-power system-on-chip microcontrollers with integrated Wi-Fi and dual-mode Bluetooth.The ESP32 series employs either a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations, an Xtensa LX7 dual-core microprocessor, or a single-core RISC-V microprocessor and includes built-in antenna switches, RF balun, power amplifier, low-noise ...

  5. VPX - Wikipedia

    en.wikipedia.org/wiki/VPX

    6U VPX Video Output Module from Wolf company on DSEI-2019 3U VPX module. VPX, also known as VITA 46, is a set of standards for connecting components of a computer (known as a computer bus), commonly used by defense contractors. Some are ANSI standards such as ANSI/VITA 46.0–2019.

  6. COM Express - Wikipedia

    en.wikipedia.org/wiki/COM_Express

    COM Express Type 6 Module VIA COMe-8X92 with VIA Nano X2 COM Express Carrier Board. COM Express is a form factor for computer-on-modules (COMs), which are highly integrated and compact computers that can be used in design applications much like integrated circuit components.

  7. 2 nm process - Wikipedia

    en.wikipedia.org/wiki/2_nm_process

    In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.

  8. Mobile PCI Express Module - Wikipedia

    en.wikipedia.org/wiki/Mobile_PCI_Express_Module

    Mobile PCI Express Module (MXM) is an interconnect standard for GPUs (MXM Graphics Modules) in laptops using PCI Express created by MXM-SIG. The goal was to create a non-proprietary, industry standard socket, so one could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.

  9. Trusted Platform Module - Wikipedia

    en.wikipedia.org/wiki/Trusted_Platform_Module

    A Trusted Platform Module (TPM) is a secure cryptoprocessor that implements the ISO/IEC 11889 standard. Common uses are verifying that the boot process starts from a trusted combination of hardware and software and storing disk encryption keys. A TPM 2.0 implementation is part of the Windows 11 system requirements. [1]