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In time management, gold plating is the phenomenon of working on a project or task past the point of diminishing returns.. For example, after having met a project's requirements, the manager or the developer works on further enhancing the product, thinking that the customer will be delighted to see additional or more polished features, beyond that which what was asked for or expected.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
Properly defining project scope requires thorough investigation by the project manager during the initial planning phase of a project. Failure to gather all information from all relevant stakeholders is a common reason for incomplete scope statements and missing requirements, which can frequently and easily lead to scope creep later in the project.
If requirements are not completely defined and described and if there is no effective change control in a project, scope or requirement creep may ensue. [ 4 ] [ 5 ] : 434 [ 3 ] : 13 Scope management is the process of defining, [ 3 ] : 481–483 and managing the scope of a project to ensure that it stays on track, within budget, and meets the ...
Gold-plating is a term used to characterise the process whereby the powers of an EU directive are extended when being transposed into the national laws of a member state. [ 1 ] [ 2 ] [ 3 ]
Global physical gold ETFs (those that invest in physical gold bullion) have had a six-month streak of inflows as of November 2024, adding $4.3 billion in October alone, according to the World Gold ...
My best friend and I both named our daughters Annika. We live in different countries, so we thought the shared name would be a great connection for them.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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