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2. Die cutting (web) - Wikipedia

   en.wikipedia.org/wiki/Die_cutting_(web)

   Rotary die cutting is die cutting using a cylindrical die on a rotary press and may be known as a rotary die cutter or RDC. A long sheet or web of material will be fed through the press into an area known as a "station" which holds a rotary tool that will cut out shapes, make perforations or creases, or even cut the sheet or web into smaller parts.

3. Die (integrated circuit) - Wikipedia

   en.wikipedia.org/wiki/Die_(integrated_circuit)

   The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. 1-watt red power LED die. There are three commonly used plural forms: dice, dies, and die. [1] [2] To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.

4. Die (manufacturing) - Wikipedia

   en.wikipedia.org/wiki/Die_(manufacturing)

   A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, [1] as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not. Like molds, dies are generally customized to the item they are ...

5. Die preparation - Wikipedia

   en.wikipedia.org/wiki/Die_preparation

   In the manufacturing of micro-electronic devices, die cutting, dicing or singulation is a process of reducing a wafer containing multiple identical integrated circuits to individual dies each containing one of those circuits. During this process, a wafer with up to thousands of circuits is cut into rectangular pieces, each called a die.

6. Tap and die - Wikipedia

   en.wikipedia.org/wiki/Tap_and_die

   Taps and dies are tools used to create screw threads, which is called threading. Many are cutting tools; others are forming tools. A tap is used to cut or form the female portion of the mating pair (e.g. a nut). A die is used to cut or form the male portion of the mating pair (e.g. a bolt).

7. Die singulation - Wikipedia

   en.wikipedia.org/wiki/Die_singulation

   Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .