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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...
Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology (SMT) components to a printed circuit board (PCB). Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly.
The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount.
Heat sinks provide a path for heat from the LED source to outside medium. Heat sinks can dissipate power in three ways: conduction (heat transfer from one solid to another), convection (heat transfer from a solid to a moving fluid, which for most LED applications will be air), or radiation (heat transfer from two bodies of different surface temperatures through Thermal radiation).
Dip soldering is used for both through-hole printed circuit assemblies, and surface mount. It is one of the cheapest methods to solder and is extensively used in the small scale industries of developing countries . Dip soldering is the manual equivalent of automated wave soldering. The apparatus required is just a small tank containing molten ...
Sensors installed to a fixture to check selective solder machine parameters Selective soldering machine. Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes.
When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...
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