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2. Liquid optically clear adhesive - Wikipedia

   en.wikipedia.org/.../Liquid_optically_clear_adhesive

   After application, the adhesive is cured onto the device through ultraviolet light (UV), heat, moisture, or a combination, depending on the manufacturer and specifications. Major applications include capacitive touch panels, 3D televisions (3D TV), and glass retarders. Optical bonding improves optical performance of displays.

3. UV curing - Wikipedia

   en.wikipedia.org/wiki/UV_curing

   UV-cured adhesive has become a high speed replacement for two-part adhesives, eliminating the need for solvent removal, ratio mixing, and potential life concern. [5] It is used in flexographic , offset , pad , and screen printing processes; where UV curing systems are used to polymerize images on screen-printed products, ranging from T-shirts ...

4. Powder coating on glass - Wikipedia

   en.wikipedia.org/wiki/Powder_coating_on_glass

   After cleaning, an opaque base coat of powder is applied to the glass substrate as the initial, most important layer of UV protection. Once the powder attracts, the product is heated to activate the process of gelling, which secures the adhesive bond. It is crucial to control the amount of powder that goes on to the surface.

5. Optical bonding - Wikipedia

   en.wikipedia.org/wiki/Optical_bonding

   Optical bonding is the use of an optical-grade adhesive to glue a glass to the top surface of a display. The main goal of optical bonding is to improve the display performance under outdoor environments. This method eliminates the air gap between the cover glass and the display. [2]

6. Plasma activation - Wikipedia

   en.wikipedia.org/wiki/Plasma_activation

   Quality of adhesive bonding such as gluing, painting, varnishing and coating depends strongly on the ability of the adhesive to efficiently cover the substrate area. This happens when the surface energy of the substrate is greater than the surface energy of the adhesive. However, high strength adhesives have high surface energy.

7. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]