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Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
Tape-automated bonding: Variation of COF, where a flip chip is mounted directly to a flex circuit without the use of bonding wires. Used by LCD driver ICs. COG: Chip-on-glass: Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
The chip can be mounted either on the top or the bottom (the pinned side). Connections can be made either by wire bonding or through flip chip mounting. Typically, PGA packages use wire bonding when the chip is mounted on the pinned side, and flip chip construction when the chip is on the top side.
For example, the "micro-FCBGA" (flip chip ball grid array) is Intel's current [when?] BGA mounting method for mobile processors that use a flip chip binding technology. It was introduced with the Coppermine Mobile Celeron. [citation needed] Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by ...
3D packaging refers to 3D integration schemes that rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system in package (3D SiP) and 3D wafer level package (3D WLP). 3D SiPs that have been in mainstream manufacturing for some time and have a well ...
These techniques are usually used when the die will be wire bonded; dies with flip chip technology do not use these attachment techniques. [15] [16] IC bonding is also known as die bonding, die attach, and die mount. [17] The following operations are performed at the packaging stage, as broken down into bonding, encapsulation, and wafer bonding ...
bonding – any of several technologies that attach one electronic circuit or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc. breadboard – a construction base for prototyping of electronics; bumping – the formation of microbumps on the surface of an electronic circuit in preparation for ...
Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.
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