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  2. Adhesive remover - Wikipedia

    en.wikipedia.org/wiki/Adhesive_remover

    Adhesive removers are intended to break down glue so that it can be removed from surfaces easily. [1] [2] [3] Formulations may be designed to remove a broad range of adhesives or to address a specific bond. [1] Many general purpose removers are intended to remove residue from adhesive tape. [1] [2] [3]

  3. List of glues - Wikipedia

    en.wikipedia.org/wiki/List_of_glues

    ~4 hours for softwood, 8 for hardwood; must be under pressure for >0.5-2 hrs tensile strength exceeds most woods, 2,200-3,00 pounds per square inch water-resistant, depending on alkalis used Woodworking, paper glue, fireproof laminates Medieval or earlier Soybean glue: As for casein glue, but using soy protein Soy protein is mixed with alkalis

  4. Wood glue - Wikipedia

    en.wikipedia.org/wiki/Wood_glue

    Hide glue is measured on the basis of its gel strength, a measure of how many grams of force it requires to depress a 1 ⁄ 2 in (13 mm) plunger 4 mm (0.16 in) into a 12.5% protein solution of the glue at 10 °C (50 °F). Glue is manufactured in standard grades from 32–512 grams (1.1–18.1 oz). 192-gram (6.8 oz) strength is the most commonly ...

  5. These 3-in-1 Nail Polish Remover Wipes Upgraded My At-Home ...

    www.aol.com/entertainment/3-1-nail-polish...

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  6. Wet wipe - Wikipedia

    en.wikipedia.org/wiki/Wet_wipe

    An individually-wrapped wet wipe Wet wipes on a shelf. A wet wipe, also known as a wet towel, wet one, moist towelette, disposable wipe, disinfecting wipe, or a baby wipe (in specific circumstances) is a small to medium-sized moistened piece of plastic [1] or cloth that either comes folded and individually wrapped for convenience or, in the case of dispensers, as a large roll with individual ...

  7. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [ 17 ] The adhesion promoter with a specific thickness is deposited, i.e. spin-coated or contact printed on the wafer to improve the bonding strength.

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