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DFI (industrial motherboards), stopped producing LanParty motherboards in 2009; ECS (Elitegroup Computer Systems) EPoX (partially defunct) First International Computer; Foxconn; Fujitsu [1] Gumstix; Intel (NUC and server motherboards) Lanner Inc (industrial motherboards) Leadtek; Lite-On; NZXT; Pegatron; PNY Technologies; Powercolor; Sapphire ...
In the case of CPUs in ball grid array packages, such as the VIA Nano and the Goldmont Plus, the CPU is directly soldered to the motherboard. [2] Memory slots into which the system's main memory is to be installed, typically in the form of DIMM modules containing DRAM chips. Can be DDR3, DDR4, DDR5, or onboard LPDDRx.
VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.
VT-d is broken or non existent on some boards until the BIOS is updated. Note that VT-d is a chipset Memory Controller Hub technology, not a processor feature, but this is complicated by later processor generations (Core i3/i5/i7) moving the MCH from the motherboard to the processor package, making only certain I series CPUs support VT-d.
PDP-11 CPU board. Computer hardware includes the physical parts of a computer, such as the central processing unit (CPU), random access memory (RAM), motherboard, computer data storage, graphics card, sound card, and computer case. It includes external devices such as a monitor, mouse, keyboard, and speakers. [1] [2]
The memory controller, which handles communication between the CPU and RAM, was moved onto the processor die by AMD beginning with their AMD K8 processors and by Intel with their Nehalem processors. One of the advantages of having the memory controller integrated on the CPU die is to reduce latency from the CPU to memory.
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