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The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.
Solder balls can be mounted on the chips by separately making the balls and then attaching them to the chips by using a vacuum pick up device to pick up the balls and then placing them into a chip with flux applied on contact pads for the balls, or by electroplating in which seed metals are first deposited onto a wafer with the chips to be bumped.
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm; Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench. Other kinds of rework require other tools. [1]
The board is double sided, with through-hole plating, green solder resist and a white legend. Both surface mount and through-hole components have been used. Modern PCBs are designed with dedicated layout software, generally in the following steps: [1] [2] Schematic capture through an electronic design automation (EDA) tool.
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Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
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