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The discbox slider (also called DBS) is a disc packaging concept in 100% carton board, found both in CD and DVD-sized packaging formats. The DBS is comparable with plastic jewel or amaray cases when it comes to size but holds more of the features of the LP style cases in terms of light weight and printability.
Example of component sizes, metric and imperial codes and comparison included Composite image of a 11×44 LED matrix lapel name tag display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
This page was last edited on 22 January 2024, at 08:59 (UTC).; Text is available under the Creative Commons Attribution-ShareAlike 4.0 License; additional terms may apply.
A modern example of multi-chip integrated circuit packages would be certain models of microprocessor, which may include separate dies for such things as cache memory within the same package. In a technique called flip chip , digital integrated circuit dies are inverted and soldered to a module carrier, for assembly into large systems. [ 8 ]
Packaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use ...
Advanced Packaging is considered fundamental in expanding the Moore’s Law. [6] [2] An example of heterogeneus integration is Intel's EMIB, which uses "bridges" made on silicon substrates, to connect different dies together. [7] Another example is TSMC's CoWoS [8] [9] (chip-on-wafer-on-substrate) technology which uses an interposer.
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