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  2. Three-layer architecture - Wikipedia

    en.wikipedia.org/wiki/Three-layer_architecture

    The Three-Layer Architecture is a hybrid reactive/deliberative robot architecture developed by R. James Firby [1] that consists of three layers: a reactive feedback control mechanism, a reactive plan execution mechanism, and a mechanism for performing time-consuming deliberative computations.

  3. Mobile architecture - Wikipedia

    en.wikipedia.org/wiki/Mobile_Architecture

    Mobile architecture allows maintaining this connection whilst during transit. [1] Each day the number of mobile devices is increasing, mobile architecture is the pieces of technology needed to create a rich, connected user experience. Currently, there is a lack of uniform interoperability plans and implementation.

  4. Shearing layers - Wikipedia

    en.wikipedia.org/wiki/Shearing_layers

    Shearing layers is a concept coined by architect Frank Duffy, which was later elaborated by Stewart Brand in his book, How Buildings Learn: What Happens After They're Built (Brand, 1994), and refers to buildings as composed of several layers of change. The concept has been adopted by a number of technology vendors to also describe the different ...

  5. Yoshizawa–Randlett system - Wikipedia

    en.wikipedia.org/wiki/Yoshizawa–Randlett_system

    The origami crane diagram, using the Yoshizawa–Randlett system. The Yoshizawa–Randlett system is a diagramming system used to describe the folds of origami models. Many origami books begin with a description of basic origami techniques which are used to construct the models.

  6. Message Transfer Part - Wikipedia

    en.wikipedia.org/wiki/Message_Transfer_Part

    MTP Level 3 is sometimes abbreviated MTP3; MTP Level 2, MTP2. [2] MTP and SCCP are together referred to as the Network Service Part (NSP). [3] There is no one-to-one mapping of MTP Levels 1 through 3 onto the OSI model. [4] Instead, MTP provides the functionality of layers 1, 2 and part of layer 3 in the OSI model. [5]

  7. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  8. C4 model - Wikipedia

    en.wikipedia.org/wiki/C4_model

    The C4 model relies at this level on existing notations such as Unified Modelling Language (UML), Entity Relation Diagrams (ERD) or diagrams generated by Integrated Development Environments (IDE). For level 1 to 3, the C4 model uses 5 basic diagramming elements: persons, software systems, containers, components and relationships.

  9. Foundation (engineering) - Wikipedia

    en.wikipedia.org/wiki/Foundation_(engineering)

    Shallow foundations of a house versus the deep foundations of a skyscraper. Foundation with pipe fixtures coming through the sleeves. In engineering, a foundation is the element of a structure which connects it to the ground or more rarely, water (as with floating structures), transferring loads from the structure to the ground.