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The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
It is widely used in industrial processes to prepare surfaces for bonding, gluing, coating and painting. Plasma processing achieves this effect through a combination of reduction of metal oxides, ultra-fine surface cleaning from organic contaminants, modification of the surface topography and deposition of functional chemical groups.
Optical bonding improves the contrast ratio by reducing the amount of reflected light, thus improving viewability. This is especially important in outdoor applications, where direct sunlight can decrease viewability. [1] Fresnel reflections from the glass as well as the adhesive can degrade LCD viewability. Reflection is caused by an impedance ...
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductors, metals, and dielectrics can be obtained even at room temperature ...
Intermolecular forces such as Van der Waals forces, hydrogen bonds, and dipole–dipole interactions are typically not sufficiently strong to hold two apparently conformal rigid bodies together, since the forces drop off rapidly with distance, [2] and the actual area in contact between the two bodies is small due to surface roughness and minor imperfections.
Crystalline coatings (or crystalline mirrors [1]) are a type of thin-film optical interference coating that is made by merging monocrystalline multilayers deposited via processes such as molecular-beam epitaxy (MBE) and metalorganic vapour-phase epitaxy (MOVPE) with microfabrication techniques including direct bonding and selective etching.