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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
The original Cricut machine has cutting mats of 150 mm × 300 mm (6 in × 12 in), the larger Cricut Explore allows mats of 300 mm × 300 mm, and 300 mm × 610 mm (12 in × 12 in, and 12 in × 24 in). The largest machine will produce letters from a 13 to 597 mm (0.5 to 23.5 in) high.
The laser cutter is a machine that uses a laser to cut materials such as chip board, matte board, felt, wood, and acrylic up to 3/8 inch (1 cm) thickness. The laser cutter is often bundled with a driver software which interprets vector drawings produced by any number of CAD software platforms.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser marked electronic part. Laser engraving is the practice of using lasers to engrave an object. The engraving process renders a design by physically cutting into the object to remove material. The technique does not involve the use of inks or tool bits that contact the engraving surface and wear out, giving it an advantage over alternative ...
The use of lasers in Micro Materials Processing has found broad application in the development and manufacturing of screens for smartphones, tablet computers, and LED TVs. [14] A detailed list of industrial and commercial laser applications includes: Laser cutting. Laser welding.
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