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Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC (computer numerical control) are used to direct the laser beam to the material. A commercial laser for cutting materials uses a motion control system to follow a CNC or G-code of the pattern to be cut onto the material.
Laser beam machining has the ability to engrave or cut nearly all materials, where traditional cutting methods may fall short. There are several types of lasers, and each have different uses. The cost of maintaining lasers is moderately low due to the low rate of wear and tear, as there is no physical contact between the tool and the workpiece.
In laser science, the beam parameter product (BPP) is the product of a laser beam's divergence angle (half-angle) and the radius of the beam at its narrowest point (the beam waist). [1] The BPP quantifies the quality of a laser beam, and how well it can be focused to a small spot.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Multiaxis machining is a manufacturing process that involves tools that move in 4 or more directions and are used to manufacture parts out of metal or other materials by milling away excess material, by water jet cutting or by laser cutting. This type of machining was originally performed mechanically on large complex machines.
Laser and laser amplifier development: Thermal relaxation in pulse-pumped amplifiers causes temporal and spatial variations in the gain crystal, effectively distorting the beam profile of the amplified light. A beam profiler placed at the output of the amplifier yields a wealth of information about transient thermal effects in the crystal.
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Laser marking on stainless steel A laser engraving machine A laser engraver. A laser engraving machine consists of three main parts: a laser, a controller, and a surface. [2] The laser is a drawing tool: the beam emitted from it allows the controller to trace patterns onto the surface.
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