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Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
Peltier cooling plates / ˈ p ɛ l t i. eɪ / take advantage of the Peltier effect to create a heat flux between the junction of two different conductors of electricity by applying an electric current. [9] This effect is commonly used for cooling electronic components and small instruments.
Multiple Peltier junctions, taking care of each specific temperature window, can usually be stacked to further enhance the overall performance on electronics cooling. As active heat pumps which consume power, thermoelectric coolers can produce temperatures below ambient, which is impossible with passive heatsinks, radiator-cooled liquid cooling ...
The Peltier effect can be used to create a heat pump. Notably, the Peltier thermoelectric cooler is a refrigerator that is compact and has no circulating fluid or moving parts. Such refrigerators are useful in applications where their advantages outweigh the disadvantage of their very low efficiency.
Cooling air temperature can be improved with these guidelines: Supply cool air to the hot components as directly as possible. Examples are air snorkels and tunnels that feed outside air directly and exclusively to the CPU or GPU cooler. For example, the BTX case design prescribes a CPU air tunnel. Expel warm air as directly as possible.
The front of the unit (facing the front of the PC case) has a 120 mm Radiator which is the primary heat exchanger.It is cooled by a fan. After passing the radiator, the cooling liquid moves through a thermoelectric fluid chiller consisting of a liquid cooling block with two Peltier plates.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
The flow of charge carriers between the hot and cold regions in turn creates a voltage difference. In 1834, Jean Charles Athanase Peltier discovered the reverse effect, that running an electric current through the junction of two dissimilar conductors could, depending on the direction of the current, cause it to act as a heater or cooler. [7]
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