Search results
Results from the WOW.Com Content Network
Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials such as metal matrix composites.
A plume ejected from a SrRuO 3 target during pulsed laser deposition. One possible configuration of a PLD deposition chamber. Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited.
Thermal laser epitaxy (TLE) is a physical vapor deposition technique that utilizes irradiation from continuous-wave lasers to heat sources locally for growing films on a substrate. [ 1 ] [ 2 ] This technique can be performed under ultra-high vacuum pressure or in the presence of a background atmosphere, such as ozone , to deposit oxide films.
Evaporative deposition: the material to be deposited is heated to a high vapor pressure by electrical resistance heating in "high" vacuum. [4] [5] Close-space sublimation, the material, and substrate are placed close to one another and radiatively heated. Pulsed laser deposition: a high-power laser ablates material from the target into a vapor.
Laser ablation or photoablation (also called laser blasting [1] [2] [3]) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates .
Growth rates above 2 micrometres per minute produce polycrystalline silicon, and negative growth rates may occur if too much hydrogen chloride byproduct is present. (Hydrogen chloride may be intentionally added to etch the wafer.) [citation needed] An additional etching reaction competes with the deposition reaction:
Etching and deposition each account for 28% of semiconductor cost, totaling 56%, with lithography next at 22%. As Bleeker explained, lithography transfers chip design; but it is etching that ...
Typical deposition rates for electron beam evaporation range from 1 to 10 nanometres per second. ... Pulsed laser deposition systems work by an ... Thin metal layers ...