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  2. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device (SMD).

  3. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Surface-mount technology (SMT) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.

  5. Here's what the abbreviation SMT means - AOL

    www.aol.com/lifestyle/heres-abbreviation-smt...

    The term "smt" has a different connotation in different contexts and even in different fandoms. Sometimes it's an abbreviation and other times it's an acronym. This is what "smt" means all over ...

  6. Dual in-line package - Wikipedia

    en.wikipedia.org/wiki/Dual_in-line_package

    The SOIC (Small Outline IC), a surface-mount package which is currently [when?] very popular, particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being a second bend in the leads to flatten them parallel to the bottom plane ...

  7. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]

  8. Simultaneous multithreading - Wikipedia

    en.wikipedia.org/wiki/Simultaneous_multithreading

    Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures .

  9. Land grid array - Wikipedia

    en.wikipedia.org/wiki/Land_grid_array

    LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]