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Sze worked for Bell Labs until 1990, after which he returned to Taiwan and joined the faculty of National Chiao Tung University. [1] He is well known for his work in semiconductor physics and technology, including his 1967 invention (with Dawon Kahng) of the floating-gate transistor, [2] now widely used in non-volatile semiconductor memory devices.
Float-zone silicon is typically used for power devices and detector applications, where high-resistivity is required. [1]: 364 It is highly transparent to terahertz radiation, and is usually used to fabricate optical components, such as lenses and windows, for terahertz applications.
A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators.
AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, [128] with Zen 2-based CPUs and APUs from July 2019, [129] and for both PlayStation 5 [130] and Xbox Series X/S [131] consoles' APUs, released both in November 2020.
Simon Sze stated that Braun's research was the earliest systematic study of semiconductor devices. [40] Also in 1874, Arthur Schuster found that a copper oxide layer on wires had rectification properties that ceased when the wires are cleaned. William Grylls Adams and Richard Evans Day observed the photovoltaic effect in selenium in 1876. [41]
The rectifying metal–semiconductor junction forms a Schottky barrier, making a device known as a Schottky diode, while the non-rectifying junction is called an ohmic contact. [1] In contrast, a rectifying semiconductor–semiconductor junction, the most common semiconductor device today, is known as a p–n junction .)
In 2003, a research team at NEC fabricated the first MOSFETs with a channel length of 3 nm, using the PMOS and NMOS processes. [20] [21] In 2006, a team from the Korea Advanced Institute of Science and Technology (KAIST) and the National Nano Fab Center, developed a 3 nm width multi-gate MOSFET, the world's smallest nanoelectronic device, based on gate-all-around technology.
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.