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More recently, in order to manage CPU power dissipation, processor makers favor multi-core chip designs, thus software needs to be written in a multi-threaded or multi-process manner to take full advantage of such hardware. Many multi-threaded development paradigms introduce overhead, and will not see a linear increase in speed when compared to ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink. It corresponds to the total power drain from the direct current supply rails of the CPU. Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air.
A water block is the watercooling equivalent of a heatsink. It is a type of plate heat exchanger and can be used on many different computer components, [1]: 186 including the central processing unit (CPU), GPU, PPU, and northbridge chipset on the motherboard. There are also Monoblocks on the market that are mounted on PC motherboards and cover ...
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
As such, I/O functions are reassigned between this new central hub and the CPU compared to the previous architecture: some northbridge functions, the memory controller and PCIe lanes, were integrated into the CPU while the PCH took over the remaining functions in addition to the traditional roles of the southbridge.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).