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SCPI was defined as an additional layer on top of the IEEE 488.2-1987 specification "Standard Codes, Formats, Protocols, and Common Commands". [4] The standard specifies a common syntax, command structure, and data formats, to be used with all instruments.
IEEE Transactions on Instrumentation and Measurement is a bimonthly peer-reviewed scientific journal published by the IEEE Instrumentation and Measurement Society. It covers the theory, design and use of electronic instrumentation and measurement techniques. Its editor-in-chief is Ruqiang Yan (Xi'an Jiaotong University).
Piping and instrumentation diagram of pump with storage tank. Symbols according to EN ISO 10628 and EN 62424. A more complex example of a P&ID. A piping and instrumentation diagram (P&ID) is defined as follows: A diagram which shows the interconnection of process equipment and the instrumentation used to control the process.
HiSLIP (High-Speed LAN Instrument Protocol) is a TCP/IP-based protocol for remote instrument control of LAN-based test and measurement instruments.It was specified by the IVI Foundation [1] and is intended to replace the older VXI-11 [2] protocol.
Typical instrumentation amplifier schematic. An instrumentation amplifier (sometimes shorthanded as in-amp or InAmp) is a type of differential amplifier that has been outfitted with input buffer amplifiers, which eliminate the need for input impedance matching and thus make the amplifier particularly suitable for use in measurement and test equipment.
Virtual instrument software architecture (VISA) is a widely used application programming interface (API) in the test and measurement (T&M) industry for communicating with instruments from a computer.
The journal publishes the complete scientific documentation of the CERN Large Hadron Collider machine and detectors.These papers are published as open access. [6] It also publishes the technical reports concerning the Planck Low Frequency Instrument on board the European Space Agency's Planck satellite, which was launched in May 2009, and the three-volume technical report of the Deep ...