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Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance.
In some types, such as suspended stripline and finline, it is advantageous to make the substrate as thin as possible. Delicate semiconductor components mounted on a flexing substrate can become damaged. A hard, rigid material such as quartz might be chosen as the substrate to avoid this problem, rather than an easier-to-machine board.
It is called "soft" because it uses elastomeric materials, most notably PDMS. Soft lithography is generally used to construct features measured on the micrometer to nanometer scale. According to Rogers and Nuzzo (2005), development of soft lithography expanded rapidly from 1995 to 2005. Soft lithography tools are now commercially available.
Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. Surfaces have different uses, including producing new film or layers of material and being a base to which another substance is bonded.
A fluidized bed reactor (FBR) is a type of reactor device that can be used to carry out a variety of multiphase chemical reactions. In this type of reactor, a fluid (gas or liquid) is passed through a solid granular material (usually a catalyst) at high enough speeds to suspend the solid and cause it to behave as though it were a fluid.
Reflection high-energy electron diffraction (RHEED) is a technique used to characterize the surface of crystalline materials. RHEED systems gather information only from the surface layer of the sample, which distinguishes RHEED from other materials characterization methods that also rely on diffraction of high-energy electrons.
Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. The diagrams are not to scale, as in real devices, the gate, source, and drain contacts are not normally located in the same plane. Detail of an etch step.
The Comparative Tracking Index (CTI) is used to measure the electrical breakdown (tracking) properties of an insulating material. Tracking is an electrical breakdown on the surface of an insulating material wherein an initial exposure to electrical arcing heat carbonizes the material. The carbonized areas are more conductive than the pristine ...