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The primary application of monocrystalline silicon is in the production of discrete components and integrated circuits.Ingots made by the Czochralski method are sliced into wafers about 0.75 mm thick and polished to obtain a regular, flat substrate, onto which microelectronic devices are built through various microfabrication processes, such as doping or ion implantation, etching, deposition ...
Monocrystalline silicon (mono-Si) grown by the Czochralski method is often referred to as monocrystalline Czochralski silicon (Cz-Si). It is the basic material in the production of integrated circuits used in computers, TVs, mobile phones and all types of electronic equipment and semiconductor devices. [6]
Monocrystalline silicon boule. A boule is a single-crystal ingot produced by synthetic means. [1]A boule of silicon is the starting material for most of the integrated circuits used today.
In this process, a cylindrical ingot of high purity monocrystalline semiconductor, such as silicon or germanium, called a boule, is formed by pulling a seed crystal from a melt. [ 7 ] [ 8 ] Donor impurity atoms, such as boron or phosphorus in the case of silicon, can be added to the molten intrinsic material in precise amounts in order to dope ...
Crystalline silicon or (c-Si) is the crystalline forms of silicon, either polycrystalline silicon (poly-Si, consisting of small crystals), or monocrystalline silicon (mono-Si, a continuous crystal). Crystalline silicon is the dominant semiconducting material used in photovoltaic technology for the production of solar cells .
Solar cells, or photovoltaic cells (PV) for producing electric power from sunlight can be grown as thick epi wafers on a monocrystalline silicon "seed" wafer by chemical vapor deposition (CVD), and then detached as self-supporting wafers of some standard thickness (e.g., 250 μm) that can be manipulated by hand, and directly substituted for wafer cells cut from monocrystalline silicon ingots.
A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.
Silicon was chosen because a commercial infrastructure with mature technology for creating defect-free, ultra-pure monocrystalline silicon already exists, the Czochralski process, to service the semiconductor industry. To make a practical realisation of the kilogram, a silicon boule (a rod-like