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A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
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SpeedFan is a system monitor for Microsoft Windows that can read temperatures, voltages and fan speeds of computer components. [3] It can change computer fan speeds depending on the temperature of various components. [1] [4] The program can display system variables as charts and as an indicator in the system tray.
The inlet air temperature relates strongly with the heat-sink base temperature. For example, if there is recirculation of air in a product, the inlet air temperature is not the ambient air temperature. The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat-sink base temperature.
TM2 reduces processor temperature by lowering the CPU clock multiplier, and thereby the processor core speed. [2] In contrast, Thermal Monitor 1 inserts an idle cycle into the CPU for thermal control without decreasing multipliers. TM1 and TM2 are associated with DTS/PECI — Digital Temperature Sensor/Platform Environment Control Interface. [3]
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These sensors, after being calibrated at the factory, are able to provide digital data concerning processor temperature information. The PECI bus , allowing access to this data from chipset components, is a proprietary single-wire interface with a variable data transfer speed (from 2 kbit/s to 2 Mbit/s).