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Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
Lower chassis temperature brings lower processor die temperature, while most computer enclosures typically provide an internal thermal environment of approximately 40-45°C at a 35°C room, Intel claims. CAG provides a system to lower processor's thermal environment. The initial revision known as CAG 1.0 was released in May 2002.
On older personal computer motherboards, the southbridge is one of the two chips in the core logic chipset, handling many of a computer's input/output functions. The other component of the chipset is the northbridge, which generally handles high speed onboard communications.
A modern consumer graphics card: A Radeon RX 6900 XT from AMD. A graphics card (also called a video card, display card, graphics accelerator, graphics adapter, VGA card/VGA, video adapter, display adapter, or colloquially GPU) is a computer expansion card that generates a feed of graphics output to a display device such as a monitor.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
For example, many graphics cards on the market as of 2010 are dual slot graphics cards, using the second slot as a place to put an active heat sink with a fan. Some cards are "low-profile" cards, meaning that they are shorter than standard cards and will fit in a lower height computer chassis such as HTPC and SFF .
The inlet air temperature relates strongly with the heat-sink base temperature. For example, if there is recirculation of air in a product, the inlet air temperature is not the ambient air temperature. The inlet air temperature of the heat sink is therefore higher, which also results in a higher heat-sink base temperature.
AGP is a superset of the PCI standard, designed to overcome PCI's limitations in serving the requirements of the era's high-performance graphics cards. [2] The primary advantage of AGP is that it doesn't share the PCI bus, providing a dedicated, point-to-point pathway between the expansion slot(s) and the motherboard chipset. The direct ...