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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

  3. Tinning - Wikipedia

    en.wikipedia.org/wiki/Tinning

    The tinning set consists of at least one pot of molten tin, with a zinc chloride flux on top, and a grease pot. The flux dries the plate and prepares it for the tin to adhere. If a second tin pot is used, called the wash pot, it contains tin at a lower temperature. This is followed by the grease pot, which contains oil and a tinning machine ...

  4. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

  6. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    For soldering n-type semiconductors, solder may be doped with antimony; indium may be added for soldering p-type semiconductors. Pure tin can also be used. [59] [96] Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's metal.

  7. Solderability - Wikipedia

    en.wikipedia.org/wiki/Solderability

    Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.

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