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On the common FR-4 substrates, 1 oz copper per ft 2 (35 μm) is the most common thickness; 2 oz (70 μm) and 0.5 oz (17.5 μm) thickness is often an option. Less common are 12 and 105 μm, 9 μm is sometimes available on some substrates.
The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]
Cassiterite is a tin oxide mineral, SnO 2.It is generally opaque, but it is translucent in thin crystals.Its luster and multiple crystal faces produce a desirable gem. . Cassiterite was the chief tin ore throughout ancient history and remains the most important source of t
As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature. [76]
Through-hole (leaded) resistors. In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Early tin cans were sealed by soldering with a tin–lead alloy, which could lead to lead poisoning. [citation needed] Automated soldering machines started to arrive in the 1870s The steel started to displace iron as a material for the cans at the very end of the 19th century. Locking side seam was invented by Max Ams in 1888, giving the rise ...
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