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Nanotechnology is an active research area that encompasses a number of disciplines such as electronics, bio-mechanics and coatings. These disciplines assist in the areas of civil engineering and construction materials. [22] If nanotechnology is implemented in the construction of homes and infrastructure, such structures will be stronger.
An example of such technology is the Nanoscale Offset Printing System (NanoOps) which was developed by researchers at the Center of High-rate Nanomanufacturing (CHN) in Northeastern University. [11] The NanoOps is a form of directed assembly which is faster and more economic than traditional 3D printing of nanosystems.
Nanotechnology's ability to observe and control the material world at a nanoscopic level can offer great potential for construction development. Nanotechnology can help improve the strength and durability of construction materials, including cement, steel, wood, and glass. [9] By applying nanotechnology, materials can gain a range of new ...
Packaging engineering, also package engineering, packaging technology and packaging science, is a broad topic ranging from design conceptualization to product placement. All steps along the manufacturing process, and more, must be taken into account in the design of the package for any given product.
The metal-chelating active packaging technology is also antioxidant active packaging that will extend the shelf-life of consumer products by controlling the oxidation. The metal-chelating active packaging technology is known to be able to remove synthetic food preservatives (e.g. EDTA) from the food product. This technology can be used to ...
As nanotechnology advances, many studies have been conducted to determine the effects nanoengineered materials can have on the environment. [22] Most textiles can lose up to 20% of their mass during their lifetime, so nanoparticles used in production of nanofabrics are at risk of being released into the air and waterways.
Sketch of the eWLB package, the first commercialized FO-WLP technology. Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
Nanoelectronics – use of nanotechnology on electronic components, including transistors so small that inter-atomic interactions and quantum mechanical properties need to be studied extensively. Nanomechanics – branch of nanoscience studying fundamental mechanical (elastic, thermal and kinetic) properties of physical systems at the nanometer ...