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Heat sinks provide a path for heat from the LED source to outside medium. Heat sinks can dissipate power in three ways: conduction (heat transfer from one solid to another), convection (heat transfer from a solid to a moving fluid, which for most LED applications will be air), or radiation (heat transfer from two bodies of different surface temperatures through Thermal radiation).
A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.
Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers.
Heat sinks function by efficiently transferring thermal energy ("heat") from an object at high temperature to a second object at a lower temperature with a much greater heat capacity. This rapid transfer of thermal energy quickly brings the first object into thermal equilibrium with the second, lowering the temperature of the first object ...
Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]
The waste heat in a high-power LED is conducted through the device to a heat sink, which dissipates heat to the surrounding air. Since the maximum operating temperature of the LED is limited, the thermal resistances of the package, the heat sink and the interface must be calculated.
2 Basic heat sink heat transfer theory model. 3 Methods to determine heat sink thermal performance. 3.1 Heat transfer theoretical model 3.2 Experimental data 3.3 Numerical data 4 Design factors which influence the thermal performance of a heat sink. 4.1 Material 4.1.1 Fin efficiency 4.1.2 Spreading resistance 4.2 Fin arrangements 4.2.1 Pin fin
In the case of the latter, it is done by using a fan blowing air into or onto the object one wants to cool. The addition of fins to a heat sink increases its total surface area, resulting in greater cooling effectiveness. There are two types of cooling pads that can be used for air cooling: one is the honeycomb design and another one is excelsior.