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Plasma cutting with a tilting head. Plasma cutting grew out of plasma welding in the 1960s, and emerged as a very productive way to cut sheet metal and plate in the 1980s. It had the advantages over traditional "metal against metal" cutting of producing no metal chips, giving accurate cuts, and producing a cleaner edge than oxy-fuel cutting ...
Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
2 "Plasma cutters working near sensitive electronics, such as CNC hardware or computers, use the contact start method. The nozzle and electrode are in contact. The nozzle is the cathode, and the electrode is the anode. When the plasma gas begins to flow, the nozzle is blown forward."
Plasma arc welding ( PAW) is an arc welding process similar to gas tungsten arc welding (GTAW). The electric arc is formed between an electrode (which is usually but not always made of sintered tungsten) and the workpiece. The key difference from GTAW is that in PAW, the electrode is positioned within the body of the torch, so the plasma arc is ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Border Patrol agents apprehended just over 84,000 migrants crossing the U.S. southern border in June, the lowest monthly number since Biden took office in 2021.
A plasma etcher, or etching tool, is a tool used in the production of semiconductor devices. A plasma etcher produces a plasma from a process gas, typically oxygen or a fluorine -bearing gas, using a high frequency electric field, typically 13.56 MHz. A silicon wafer is placed in the plasma etcher, and the air is evacuated from the process ...
Updated June 6, 2024 at 9:31 AM. A two-year-old boy was killed when an enormous tree uprooted by a tornado landed on a family home in a suburb of Detroit, as storms left a trail of destruction ...
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