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The ROG Phone is an Android gaming smartphone made by Asus and the first generation of the ROG smartphone series. It was announced on June 8, 2018 at the Computex computer expo, [1] being the first Asus smartphone to be targeted mainly to gamers. It competes with the Razer Phone, Xiaomi Black Shark, and ZTE Nubia Red Magic. [2] [3] [4]
ZenFone 2 (ZE551ML) with 4 GB RAM ZenFone 2 Deluxe (ZE551ML) The ZenFone 2 was announced at CES 2015. The flagship phablet model (ZE551ML) launched with Android 5.0 Lollipop running Asus's custom Zen UI and has a 5.5" Full HD (1920×1080) IPS display. The phone is powered by Intel Atom Moorefield SoCs with up to 4 GB of RAM, a
At Hot Chips 2016, Samsung announced GDDR6 as the successor of GDDR5X. [5] [6] Samsung later announced that the first products would be 16 Gbit/s, 1.35 V chips.[7] [8] In January 2018, Samsung began mass production of 16 Gb (2 GB) GDDR6 chips, fabricated on a 10 nm class process and with a data rate of up to 18 Gbit/s per pin.
On February 20, 2013, it was announced that the PlayStation 4 would use sixteen 4 Gb GDDR5 memory chips for a total of 8 GB of GDDR5 @ 176 Gbit/s (CK 1.375 GHz and WCK 2.75 GHz) as combined system and graphics RAM for use with its AMD-powered system on a chip comprising 8 Jaguar cores, 1152 GCN shader processors and AMD TrueAudio. [16]
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory (SDRAM) that consumes less power than other random access memory designs and is thus targeted for mobile computing devices such as laptop computers and smartphones. Older variants are also known as Mobile DDR, and abbreviated as ...
Tegra is a system on a chip (SoC) series developed by Nvidia for mobile devices such as smartphones, personal digital assistants, and mobile Internet devices. The Tegra integrates an ARM architecture central processing unit (CPU), graphics processing unit (GPU), northbridge , southbridge , and memory controller onto one package.
DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm (5¼ inches).
A 64 bit memory chip die, the SP95 Phase 2 buffer memory produced at IBM mid-1960s, versus memory core iron rings 8GB DDR3 RAM stick with a white heatsink Random-access memory ( RAM ; / r æ m / ) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code .