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2. In-circuit testing - Wikipedia

   en.wikipedia.org/wiki/In-circuit_testing

   While in-circuit test is a very powerful tool for testing PCBs, it has these limitations: Parallel components can often only be tested as one component if the components are of the same type (i.e. two resistors); though different components in parallel may be testable using a sequence of different tests - e.g. a DC voltage measurement versus a measurement of AC injection current at a node.

3. List of electrical and electronic measuring equipment

   en.wikipedia.org/wiki/List_of_electrical_and...

   Creates constant-amplitude variable frequency sine waves to test frequency response Transistor tester: Tests transistors Tube tester: Tests vacuum tubes (triode, tetrode etc.) Wattmeter: Measures power in a circuit Vectorscope: Displays the phase of the colors in color TV Video signal generator: Generates video signal for testing purposes Voltmeter

4. Bead probe technology - Wikipedia

   en.wikipedia.org/wiki/Bead_probe_technology

   Side view of a PCB showing a solder bead and test probe. Bead probe technology is a probing method used to connect electronic test equipment to the device under test (DUT) within a bed of nails fixture. The technique was first used in the 1990s [3] and originally given the name “Waygood Bump” after one of the main proponents, Rex Waygood.

5. Teradyne - Wikipedia

   en.wikipedia.org/wiki/Teradyne

   In the 1980s, Teradyne expanded its sub-assembly test business by acquiring Zehntel, a leading manufacturer of in-circuit board test systems. In 1987, the company introduced the first analog VLSI test system, the A500, which led the market in testing integrated devices that provided the interface between analog and digital data .

6. Flying probe - Wikipedia

   en.wikipedia.org/wiki/Flying_probe

   Flying probes were introduced in the late 1980’s and can be found in many manufacturing and assembly operations, most often in manufacturing of electronic printed circuit boards. A flying probe tester uses one or more test probes to make contact with the circuit board under test; the probes are moved from place to place on the circuit board ...

7. Dye-and-pry - Wikipedia

   en.wikipedia.org/wiki/Dye-and-Pry

   Dye-n-Pry is a useful failure analysis technique to detect cracking or open circuits in BGA solder joints. [2] This has some practical advantages over other destructive techniques, such as cross sectioning, as it can inspect a full ball grid array which may consist of hundreds of solder joints. Cross sectioning, on the other hand, may only be ...