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  2. 22 nm process - Wikipedia

    en.wikipedia.org/wiki/22_nm_process

    On September 22, 2009, during the Intel Developer Forum Fall 2009, Intel showed a 22 nm wafer and announced that chips with 22 nm technology would be available in the second half of 2011. [9] SRAM cell size is said to be 0.092 μm 2, smallest reported to date. On January 3, 2010, Intel and Micron Technology announced the first in a family of 25 ...

  3. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    TSMC began risk production of 256 Mbit SRAM memory chips using a 7 nm process in April 2017. [125] Samsung and TSMC began mass production of 7 nm devices in 2018. [126] Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC. [127]

  4. Orders of magnitude (length) - Wikipedia

    en.wikipedia.org/wiki/Orders_of_magnitude_(length)

    3.8 nmsize of an albumin molecule; 5 nmsize of the gate length of a 16 nm processor; 5 nm – the average half-pitch of a memory cell manufactured circa 2019–2020; 6 nm – length of a phospholipid bilayer; 6–10 nm – thickness of cell membrane; 6.8 nm – width of a haemoglobin molecule; 7 nm – diameter of actin filaments

  5. International Technology Roadmap for Semiconductors - Wikipedia

    en.wikipedia.org/wiki/International_Technology...

    The organization was divided into Technical Working Groups (TWGs) which eventually grew in number to 17, each focusing on a key element of the technology and associated supply chain. Traditionally, the ITRS roadmap was updated in even years, and completely revised in odd years. [7] The last revision of the ITRS Roadmap was published in 2013.

  6. ASML Holding - Wikipedia

    en.wikipedia.org/wiki/ASML_Holding

    In 2009, the IMEC research center in Belgium produced the world's first functional 22 nm CMOS Static random-access memory memory cells with a prototype EUV lithography machine. [16] After decades of development, ASML shipped the first production extreme ultraviolet lithography machine in either 2011 [ 12 ] or 2013.

  7. 2 nm process - Wikipedia

    en.wikipedia.org/wiki/2_nm_process

    In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.

  8. 3 nm process - Wikipedia

    en.wikipedia.org/wiki/3_nm_process

    In December 2022, at IEDM 2022 conference, TSMC disclosed a few details about their 3 nm process technologies: contacted gate pitch of N3 is 45 nm, minimum metal pitch of N3E is 23 nm, and SRAM cell area is 0.0199 μm 2 for N3 and 0.021 μm 2 for N3E (same as in N5). For N3E process, depending on the number of fins in cells used for design ...

  9. Ivy Bridge (microarchitecture) - Wikipedia

    en.wikipedia.org/wiki/Ivy_Bridge_(microarchitecture)

    Ivy Bridge is the codename for Intel's 22 nm microarchitecture used in the third generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors , from the former generation's 32 nm Sandy Bridge microarchitecture—also known as tick–tock model .

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