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Technoprobe was founded in Merate near Milan in 1996 by Giuseppe Crippa, who had developed a new and more rapid method to manufacture probe cards. [2] As the company grew, it opened manufacturing and sales offices abroad, including in Rousset, France (2001), Singapore (2003), San Jose, California (2007), Philippines (2010), Korea (2015), and Japan (2018).
Company Name Symbol B P P L Holdings: CSE: BPPL.N0000: Bairaha Farms: CSE: BFL.N0000: Balangoda Plantations: CSE: BALA.N0000: Bansei Royal Resorts Hikkaduwa: CSE: BRR ...
Airport and Aviation Services (Sri Lanka) Limited; The Associated Newspapers of Ceylon Ltd; B.C.C. Lanka Ltd; B.O.C. Bank; CTB BUS; Lynx BUS; Building Materials Corporation Ltd
Normally a probe card is inserted into a wafer prober, inside which the position of the wafer to be tested will be adjusted to ensure a precise contact between the probe card and wafer. Once the probe card and the wafer are loaded, a camera in the prober will optically locate several tips on the probe card and several marks or pads on the wafer ...
The company's product offering includes automated defect inspection and metrology systems, probe card test and analysis systems, and lithography step-and-repeat systems. In addition, Onto Innovation provides a broad range of software products designed to improve yield, control processes and reduce manufacturing costs.
LMD 100, dubbed as "Sri Lanka's Fortune 500", annually lists the leading 100 quoted companies in Sri Lanka. Only the top 10 companies are listed below. All revenue figures reported before the financial year ending 2024. [2] [3]
The Lanka Hospitals Corporation: 22,351: 0.63 Health Care Equipment and Services: 1997 [39] Teejay Lanka: 22,147: 0.62 Consumer Durables and Apparel: 2000 [40] Brown and Company: 21,422: 0.60 Capital Goods: 1892 [41] Dilmah Ceylon Tea Company: 20,986: 0.59 Food, Beverage and Tobacco: 1981 [42] Sunshine Holdings: 20,909: 0.59 Food, Beverage and ...
the probe card may be damaged from repeated contact, or become contaminated with debris created by contact with the wafer [2] the probe will act as a circuit and affect the results of the test. For this reason, the tests performed at wafer sort cannot always be identical and as extensive as those performed at the final device test after ...