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Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Processor manufacturers usually release two power consumption numbers for a CPU: typical thermal power, which is measured under normal load (for instance, AMD's average CPU power) maximum thermal power, which is measured under a worst-case load; For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power.
Advanced Configuration and Power Interface (ACPI) is an open standard that operating systems can use to discover and configure computer hardware components, to perform power management (e.g. putting unused hardware components to sleep), auto configuration (e.g. Plug and Play and hot swapping), and status monitoring.
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating ...
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Pricing starts at $629. An Intel Core i7 processor is an option on the Vostro 3700, the only Vostro 3000 series laptop to offer this processor. Operating system options are the same as those offered with the Vostro 3300. CPU: Intel Core i3-350M, Core i5-450M, i5-520M, or Core i7-720QM; Display: 17.3" LED display (1600×900) with anti-glare
Arrandale is the code name for a family of mobile Intel processors, sold as mobile Intel Core i3, i5 and i7 as well as Celeron and Pentium. [1] [2] It is closely related to the desktop Clarkdale processor; both use dual-core dies based on the Westmere 32 nm die shrink of the Nehalem microarchitecture, and have integrated Graphics as well as PCI Express and DMI links.