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The heat equation is a consequence of Fourier's law of conduction (see heat conduction). If the medium is not the whole space, in order to solve the heat equation uniquely we also need to specify boundary conditions for u .
Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules with more kinetic energy; collisions between molecules distributes this kinetic energy until an object has the same kinetic energy throughout.
It quantifies how effectively a material can resist the transfer of heat through conduction, convection, and radiation. It has the units square metre kelvins per watt (m 2 ⋅K/W) in SI units or square foot degree Fahrenheit–hours per British thermal unit (ft 2 ⋅°F⋅h/Btu) in imperial units. The higher the thermal insulance, the better a ...
In the mathematical study of heat conduction and diffusion, a heat kernel is the fundamental solution to the heat equation on a specified domain with appropriate boundary conditions. It is also one of the main tools in the study of the spectrum of the Laplace operator , and is thus of some auxiliary importance throughout mathematical physics .
The control volume integration of the steady part of the equation is similar to the steady state governing equation's integration. We need to focus on the integration of the unsteady component of the equation. To get a feel of the integration technique, we refer to the one-dimensional unsteady heat conduction equation. [3]
In the above equation, four terms represents transience, convection, diffusion and a source term respectively, where T is the temperature in particular case of heat transfer otherwise it is the variable of interest; t is time; c is the specific heat; u is velocity; ε is porosity that is the ratio of liquid volume to the total volume; ρ is ...
These equations can be different in nature, e.g. elliptic, parabolic, or hyperbolic. The first well-documented use of this method was by Evans and Harlow (1957) at Los Alamos. The general equation for steady diffusion can easily be derived from the general transport equation for property Φ by deleting transient and convective terms. [1]
Thermal contact resistance is significant and may dominate for good heat conductors such as metals but can be neglected for poor heat conductors such as insulators. [2] Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials.